CN/EN

产品与市场

S7045GH

特点

高Tg>170℃ (DSC),无卤材料

● 低插损,Dk/Df @1GHz: 3.95/0.0095

● 更低的Z轴热膨胀系数

应用领域

● 服务器、交换机、基站和线卡
  • 产品性能
  • 产品证书
  • 资料下载
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
Tg IPC-TM-650 2.4.24.4
DMA
190
Td IPC-TM-650 2.4.24.6 5% wt. loss 415
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 35
After Tg ppm/℃ 245
50-260℃ % 2.3
T260 IPC-TM-650 2.4.24.1 TMA min ≥60
T288 IPC-TM-650 2.4.24.1 TMA min 60
Thermal Stress
IPC-TM-650 2.4.13.1
288℃, solder dip
-- PASS
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1GHz -- 4.15
IPC-TM-650 2.5.5.5
10GHz
-- 3.95
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1GHz -- 0.0080
IPC-TM-650 2.5.5.5
10GHz
-- 0.0095
Peel Strength (1oz copper foil)
After thermal Stress 288℃,10s N/mm 1.0
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.12
Flammability UL94 C-48/23/50 Rating V-0

Remarks:

Remarks:

1.       Meet IPC-4101/130 specification sheet.

2.       626969cm澳门 the typical value is based on the 0.76mm (6*2116)specimen, but not guarantee data.

3.       626969cm澳门 the typical values listed above are for yourreference only and not intended for specification. Please contact ShengyiTechnology Co., Ltd. for detailed information. 626969cm澳门 rights from this data sheetare reserved by Shengyi Technology Co., Ltd.


Explanation: C=Humidity conditioning,D=Immersion conditioning in distilled water, E=Temperature conditioning. Thefirst digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

友情链接:626969cm澳门  626969cm澳门(中国)有限公司  
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