CN/EN

产品与市场

SH260

特点

● Polyimide system

● Ultra-high thermal performance

● Tough resin system, Non-MDA chemistry

● Maintain mechanical strength and bonding strength at high temperature

● Halogen-free, chemistry and lead-free compatible

● RoHS/WEEE compliant

应用领域

Burn-in Board

Down Hole

Aircraft and Aerospace

Other PCB requirements to work under high temperature for long time

  • 产品性能
  • 产品证书
  • 资料下载
Items Method Condition Unit Typical Value
Tg 2.4.24 TMA >250
Td 2.4.24.6 5% wt. loss 429
T300 2.4.24.1
TMA min
>60
CTE (Z-axis) 2.4.24 50-260℃ (X/Y) ppm/℃ 12-15
α1 (before Tg) ppm/℃ 45
50-260℃ % 1.20
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 - 4.12
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50
- 0.007
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 7.45 x 107
Surface Resistivity
2.5.17.1
C-96/35/90 4.79 x 107
Arc Resistance 2.5.1 D-48/50+D-0.5/23 s 180
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV 40.5
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm[lb/in] 1.37[7.83]
Flexural Strength 2.4.4 50℃/260 MPa

530/439

Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.26
Flammability
UL94
C-48/23/50
Rating
HB

Remarks:

1. Specimen thickness: 1.6mm. Test method is according to IPC-TM-650.

2. 626969cm澳门 the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. 626969cm澳门 rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.

友情链接:626969cm澳门  626969cm澳门(中国)有限公司  
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